Formed and molded inductors

Formed inductors, Molded inductors, Resin inductors, glued inductors, Formed chokes, Molded choked, Resin chokes, glued chokes, Formed coils, Molded coils, Resin coils, glued coils, Unusual Operations and Processes for Industry - NEOTECH offers specialized services: thermocompression, tinning, UV bonding, assembly, and coil winding. We implement unconventional processes for the industry. Glue UV Adhesive pouring

Dedicated resin-filled chokes, chokes with a glue point for automatic assembly and molded inductors

Modern electronics production requires components resistant to vibration, high temperatures, and humidity. Furthermore, the assembly of components and products is often fully automated. Therefore, molded inductors – resin-encapsulated chokes and adhesive-point chokes for automated PCB assembly are gaining popularity – even though the purpose and technology of these two processes are different!

Potting inductive components with resin, silicone or glue (Encapsulation)

Formed inductors, Molded inductors, Resin inductors, glued inductors, Formed chokes, Molded choked, Resin chokes, glued chokes, Formed coils, Molded coils, Resin coils, glued coils, Unusual Operations and Processes for Industry - NEOTECH offers specialized services: thermocompression, tinning, UV bonding, assembly, and coil winding. We implement unconventional processes for the industry. Glue UV Adhesive pouring

Potting inductive components with epoxy resin, silicone, or specialized potting (encapsulation) compounds is used to increase the reliability, durability, and stability of the component’s electrical parameters. This process protects the windings and core from moisture, dust, aggressive chemicals, and corrosion, while also improving mechanical resistance to vibration, shock, and thermal cycling.

Encapsulation also reduces winding vibrations responsible for coil whine, reducing acoustic noise emissions. It also increases dielectric strength and operational safety at high voltages. This solution is particularly popular in automotive electronics, industrial, energy, telecommunications, railway systems, medical devices, and applications operating in harsh environmental conditions.

Applying the adhesive point for automatic Pick & Place assembly

NEOTECH - Manufacturer of inductive components: coils and chokes, RFID components. Wire components. Manufacturer of machines and devices. | SMD chokes SMD coils SMD inductors | Formed inductors, Molded inductors, Resin inductors, glued inductors, Formed chokes, Molded choked, Resin chokes, glued chokes, Formed coils, Molded coils, Resin coils, glued coils, Unusual Operations and Processes for Industry - NEOTECH offers specialized services: thermocompression, tinning, UV bonding, assembly, and coil winding. We implement unconventional processes for the industry. Glue UV Adhesive pouring

A single adhesive dot (Glue Dot) is applied directly to the inductor winding to enable automatic transport, positioning, and assembly by pick & place machines. A specially dispensed adhesive drop provides a flat gripping surface for the suction cup, as an alternative to the rounded and difficult-to-repeat winding surface.

This technology is particularly important for cylindrical coils and power chokes with horizontal windings. It is most commonly used in inductors for SMD assembly and for transporting components with non-standard shapes that lack the flat top typical of standard SMD components. Precise adhesive dispensing occurs automatically during the production process, ensuring high assembly repeatability, compatibility with AOI systems, and full integration with modern, high-performance SMT and THT lines.

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